technology

Technology

TTC Advanced Materials believes that ‘how it is made’ determines the value of the material.

Based on powder processing technology using thermal plasma, we are a platform specializing in nano, spherical, and thermal management that regenerates raw materials into high value-added ceramic fillers.

 

Even with the same raw material, the performance of the material depends on how the shape, purity, and particle size are controlled. It’s completely different.

Thermal Plasma Reactor

Thermal plasma spheroidization

TTC core process technology

Customized process design by material and particle through in-house design
Capable of handling even materials that are difficult to nanosize or shape by controlling atmosphere and pressure.
Realization of near-spherical particles through ultra-high temperature complete melting
Achieving semiconductor-grade cleanliness through a wet-free dry process

Core Technology Competencies

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Thermal plasma-based powder processing technology

By processing powder in an ultra-high temperature thermal plasma environment, shapes and properties that are difficult to obtain through general processes are realized.
TTC has improved the mass productivity and yield of this process with its own technology, making it suitable for mass production.
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Spheroidization

By completely melting the particles at ultra-high temperatures of thousands of degrees or more, complete spherical particles are realized that are closer to true spheres than the general spheroidization process.
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Particle Size Control

The size and distribution of particles are precisely designed to suit the application purpose, and even fine particles at the sub-micron (~1μm) level can be controlled.
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Dry Clean Process

By processing in a dry process without a wet process, contamination factors are minimized and the high purity required for semiconductor grade is stably secured.
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Customized Powder Design

We propose customized materials that combine purity, particle size, and shape to meet the customer’s application and requirements.

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