Introduction

Thank you for visiting our website.

TTC Advanced Materials is a specialized materials company dedicated to developing and manufacturing high-purity ceramic fillers for semiconductor packaging and thermal management applications, leveraging our proprietary thermal plasma spheroidization technology.

As semiconductor devices continue to become more highly integrated and higher in performance, the demand for advanced materials capable of efficiently dissipating heat and ensuring long-term device reliability continues to grow.

To meet these evolving needs, we are developing a next-generation portfolio of spherical ceramic fillers, beginning with spherical alumina and expanding to spherical aluminum nitride (AlN) and spherical boron nitride (BN).

Beyond thermal management materials, we are also advancing our proprietary thermal plasma technology to develop nanoscale high-melting-point materials for extreme environments, including aerospace, nuclear energy, and other advanced industries.

Looking ahead, we are committed to proactively developing innovative materials that will support the future of high-tech industries, including semiconductors, robotics, aerospace, and next-generation energy.

Guided by our belief that “the purity of materials and the precision of processes define the value of our products,” we remain committed to delivering reliable materials tailored to each customer’s unique requirements.

We sincerely appreciate your interest in TTC Advanced Materials and look forward to growing together with our customers through continuous innovation.

Thank you.

Yongseok Chang
CEO