Company Overview
TTC Advanced Materials develops and manufactures high-purity ceramic fillers needed for the semiconductor and electronics industries, with thermal plasma spheroidization technology as its core competency.
The purity of raw materials, the shape and size of particles, and the cleanliness of the process – controlling the factors that determine the performance of materials through process technology is our competitive edge.
TTC Advanced Materials Inc.
420-1 Mok-dong, Gwangju-si, Gyeonggi-do
Development and manufacturing of high-purity ceramic fillers (semiconductor packaging and thermal management materials)
Thermal Plasma Spheroidization Process · High Purity · Particle Size Control · Low-Contamination Dry Process Design
Spherical alumina (Al₂O₃) · Spherical aluminum nitride (AlN) · Spherical boron nitride (BN)
Semiconductor packaging (underfill/EMC), thermal management (TIM), low dielectric CCL, etc.
031-8027-0757
info@ttc-am.com
Thermal plasma (DC method) is a powerful process that creates extremely high temperatures reaching thousands of degrees and can instantly melt even ceramics with high melting points and reconstitute them into spheres. However,
this method has traditionally had the limitation of low productivity and yield, making it difficult to apply to mass production.
TTC Advanced Materials has dramatically improved mass productivity and yield with its proprietary thermal plasma process technology,
implementing a process suitable for mass production of ceramic filler.
What sets TTC apart is that it has both ‘material freedom afforded by ultra-high temperatures’ and ‘mass production-capable productivity.’
