product
Product
TTC Advanced Materials develops advanced materials tailored to the needs of the semiconductor packaging and thermal management industries.
Our next-generation filler portfolio is centered on spherical alumina, with spherical aluminum nitride and boron nitride to follow.
Our next-generation filler portfolio is centered on spherical alumina, with spherical aluminum nitride and boron nitride to follow.
Spherical Al₂O₃
Available in both low-alpha semiconductor grade and standard 99.99% purity grade.
Spherical AlN
Spherical, single-particle filler with excellent thermal conductivity and electrical insulation.
Spherical BN
Next-generation fillers with low dielectric constant and high thermal conductivity.
