Spherical AlN

Aluminum nitride (AlN) is a high thermal conductivity ceramic that combines excellent thermal conductivity with electrical insulation, making it ideal for applications where alumina alone cannot meet thermal management requirements.

Conventional spray-dried AlN consists of aggregated particles, resulting in high viscosity, low packing density, and limited suitability for advanced semiconductor packaging applications.

TTC Advanced Materials is developing true single-particle spherical AlN using a thermal plasma spheroidization process. The material is currently undergoing sample fabrication and characterization and is being developed for next-generation semiconductor thermal management applications.